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Ultra Low Power/High Speed CMOS SRAM 512K X 8 bit
Green package materials are compliant to RoHS
BH62UV4000
n FEATURES
Y Wide VCC low operation voltage : 1.65V ~ 3.6V Y Ultra low power consumption : VCC = 3.6V Operation current : 10mA (Max.)at 55ns 2mA (Max.) at 1MHz Standby current : 2.0uA (Typ.) at 3.0V/25OC VCC = 1.2V Data retention current : 1.0uA at 25OC Y High speed access time : -55 55ns (Max.) at VCC=1.65~3.6V Y Automatic power down when chip is deselected Y Easy expansion with CE and OE options Y Three state outputs and TTL compatible Y Fully static operation, no clock, no refresh Y Data retention supply voltage as low as 1.0V
n DESCRIPTION
The BH62UV4000 is a high performance, ultra low power CMOS Static Random Access Memory organized as 524,288 by 8 bits and operates in a wide range of 1.65V to 3.6V supply voltage. Advanced CMOS technology and circuit techniques provide both high speed and low power features with typical operating current of 1.5mA at 1MHz at 3.6V/25OC and maximum access time of 55ns at 1.65V/85OC. Easy memory expansion is provided by an active LOW chip enable (CE) and active LOW output enable (OE) and three-state output drivers. The BH62UV4000 has an automatic power down feature, reducing the power consumption significantly when chip is deselected. The BH62UV4000 is available in DICE form, JEDEC standard 32 pin 450mil Plastic SOP, 400mil TSOP-II, 600mil Plastic DIP, 8mmx13.4mm STSOP, 8mmx20mm TSOP and 36-ball BGA package.
n POWER CONSUMPTION
POWER DISSIPATION PRODUCT FAMILY
BH62UV4000DI BH62UV4000EI BH62UV4000HI BH62UV4000PI BH62UV4000SI BH62UV4000STI BH62UV4000TI Industrial -40OC to +85OC 10uA 10uA 2mA 6mA 10mA 1.5mA 5mA 8mA
OPERATING TEMPERATURE
Icc STANDBY
(ICCSB1, Max)
Icc Operating
(ICC, Max)
PKG TYPE
VCC=1.8V 10MHz fMax.
VCC=3.6V
VCC=1.8V
VCC=3.6V 1MHz 10MHz fMax. 1MHz
DICE TSOP-II BGA-36-0608 PDIP-32 SOP-32 STSOP-32 TSOP-32
n PIN CONFIGURATIONS
n BLOCK DIAGRAM
32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 OE A10 CE DQ7 DQ6 DQ5 DQ4 DQ3 GND DQ2 DQ1 DQ0 A0 A1 A2 A3
*
BH62UV4000STI BH62UV4000TI
1 2 A1
A11 A9 A8 A13 WE A17 A15 VCC A18 A16 A14 A12 A7 A6 A5 A4
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
A13 A12 A11 A10 A9 A8 A7 A6 A5 A4
Address Input Buffer
10 Row Decoder
1024
Memory Array
1024 x 4096
4096
3 NC 4 A3 5 A6 6 A8
A18 A16 A14 A12 A7 A6 A5 A4 A3 A2 A1 A0 DQ0 DQ1 DQ2 GND
1 2 3 4 5 6 7 BH62UV4000EI 8 BH62UV4000PI 9 BH62UV4000SI 10 11 12 13 14 15 16
*
32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17
VCC A15 A17 WE A13 A8 A9 A11 OE A10 CE DQ7 DQ6 DQ5 DQ4 DQ3
A
A0
B
DQ4
A2
WE
A4
A7
DQ0
C
DQ5
NC
A5
DQ1
DQ0 DQ1 DQ2 DQ3 DQ4 DQ5 DQ6 DQ7
8
Data Input Buffer 8
8
Column I/O Write Driver Sense Amp 512 Column Decoder 9
8
Data Output Buffer
D
VSS
VCC
E
VCC
VSS
F
DQ6
A18
A17
DQ2
G
DQ7
OE
CE
A16
A15
DQ3
CE WE OE VCC GND
Control
Address Input Buffer
A18 A16 A15 A14 A0 A17 A3 A2 A1
H
A9
A10
A11
A12
A13
A14
36-ball BGA top view
Brilliance Semiconductor, Inc. reserves the right to change products and specifications without notice.
Detailed product characteristic test report is available upon request and being accepted.
R0201-BH62UV4000
1
Revision 1.2 Aug. 2006
BH62UV4000
n PIN DESCRIPTIONS
Name
A0-A18 Address Input CE Chip Enable 1 Input
Function
These 19 address inputs select one of the 524,288 x 8 bit in the RAM
CE is active LOW. Chip enable must be active when data read from or write to the device. If chip enable is not active, the device is deselected and is in standby power mode. The DQ pins will be in the high impedance state when the device is deselected. The write enable input is active LOW and controls read and write operations. With the chip selected, when WE is HIGH and OE is LOW, output data will be present on the DQ pins; when WE is LOW, the data present on the DQ pins will be written into the selected memory location. The output enable input is active LOW. If the output enable is active while the chip is selected and the write enable is inactive, data will be present on the DQ pins and they will be enabled. The DQ pins will be in the high impendence state when OE is inactive. 8 bi-directional ports are used to read data from or write data into the RAM.
WE Write Enable Input
OE Output Enable Input
DQ0-DQ7 Data Input/Output Ports VCC VSS
Power Supply Ground
n TRUTH TABLE MODE
Chip De-selected (Power Down) Output Disabled Read Write
CE
H L L L
WE
X H H L
OE
X H L X
I/O OPERATION
High Z High Z DOUT DIN
VCC CURRENT
ICCSB, ICCSB1 ICC ICC ICC
NOTES: H means VIH; L means VIL; X means don't care (Must be VIH or VIL state)
n ABSOLUTE MAXIMUM RATINGS
SYMBOL
VTERM TBIAS TSTG PT IOUT
(1)
n OPERATING RANGE
UNITS
V
O
PARAMETER
Terminal Voltage with Respect to GND Temperature Under Bias Storage Temperature Power Dissipation DC Output Current
RATING
-0.5(2) to 4.6V -40 to +125 -60 to +150 1.0 20
RANG
Industrial
AMBIENT TEMPERATURE
-40OC to + 85OC
VCC
1.65V ~ 3.6V
C C
O
n CAPACITANCE
(1)
(TA = 25 C, f = 1.0MHz)
O
W
SYMBOL PAMAMETER CONDITIONS MAX. UNITS
mA CIN 1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability. 2. -2.0V in case of AC pulse width less than 30 ns R0201-BH62UV4000 CIO Input Capacitance Input/Output Capacitance VIN = 0V VI/O = 0V 6 8 pF pF
1. This parameter is guaranteed and not 100% tested.
2
Revision 1.2 Aug. 2006
BH62UV4000
n DC ELECTRICAL CHARACTERISTICS (TA = -40 C to +85 C)
PARAMETER NAME VCC VIL VIH IIL ILO VOL VOH ICC ICC1 ICCSB ICCSB1 PARAMETER
Power Supply Input Low Voltage Input High Voltage Input Leakage Current Output Leakage Current Output Low Voltage Output High Voltage Operating Power Supply Current Operating Power Supply Current Standby Current - TTL Standby Current - CMOS VIN = 0V to VCC, CE = VIH VI/O = 0V to V CC, CE = VIH or OE = VIH V CC = Max, IOL = 0.1mA V CC = Max, IOL = 2.0mA V CC = Min, IOH = -0.1mA V CC = Min, IOH = -1.0mA CE = VIL, IDQ = 0mA, f = FMAX(4) CE = VIL, IDQ = 0mA, f = 1MHz CE = VIH, IDQ = 0mA CEVCC-0.2V, VINV CC-0.2V or VIN0.2V
VCC=1.8V VCC=3.6V VCC=1.8V VCC=3.6V VCC=1.8V VCC=3.6V VCC=1.8V VCC=3.6V VCC=1.8V VCC=3.6V VCC=1.8V VCC=3.6V VCC=1.8V VCC=3.6V VCC=1.8V VCC=3.6V
O
O
TEST CONDITIONS
MIN.
1.65 -0.3(2) 1.4 2.2 ---VCC-0.2 2.4 -----
TYP.(1)
--------1.0 1.5 -2.0 2.0(5)
MAX.
3.6 0.4 0.8 VCC+0.3(3) 1 1 0.2 0.4 -8 10 1.5 2.0 0.5 1.0 10 10
UNITS
V V V uA uA V V mA mA mA uA
1. Typical characteristics are at TA=25OC and not 100% tested. 2. Undershoot: -1.0V in case of pulse width less than 20 ns. 3. Overshoot: VCC+1.0V in case of pulse width less than 20 ns. 4. FMAX=1/tRC. 5. VCC=3.0V
n DATA RETENTION CHARACTERISTICS (TA = -40 C to +85 C)
SYMBOL VDR ICCDR tCDR tR PARAMETER
VCC for Data Retention Data Retention Current Chip Deselect to Data Retention Time Operation Recovery Time
O
O
TEST CONDITIONS
CEVCC-0.2V, VINVCC-0.2V or VIN0.2V CEVCC-0.2V, VINVCC-0.2V or VIN0.2V
VCC=1.2V
MIN.
1.0 -0
TYP. (1)
-1.0 ---
MAX.
-5.0 ---
UNITS
V uA ns ns
See Retention Waveform tRC (2)
1. Typical characteristics are at TA=25OC and not 100% tested. 2. tRC = Read Cycle Time.
n LOW VCC DATA RETENTION WAVEFORM (1) (CE Controlled)
Data Retention Mode
VCC
VIH
VCC
VDR1.0V
VCC
tCDR
CEVCC - 0.2V
tR
VIH
CE
R0201-BH62UV4000
3
Revision 1.2 Aug. 2006
BH62UV4000
n AC TEST CONDITIONS
(Test Load and Input/Output Reference) Input Pulse Levels Input Rise and Fall Times Input and Output Timing Reference Level tCLZ1, tCLZ2, tOLZ, tCHZ1, tCHZ2, tOHZ, tWHZ, tOW Output Load Others VCC / 0V 1V/ns 0.5Vcc CL = 5pF+1TTL CL = 30pF+1TTL ALL INPUT PULSES 1 TTL Output CL(1) VCC GND
10% 90% 90% 10%
n KEY TO SWITCHING WAVEFORMS
WAVEFORM INPUTS MUST BE STEADY MAY CHANGE FROM "H" TO "L" MAY CHANGE FROM "L" TO "H" DON'T CARE ANY CHANGE PERMITTED DOES NOT APPLY OUTPUTS MUST BE STEADY WILL BE CHANGE FROM "H" TO "L" WILL BE CHANGE FROM "L" TO "H" CHANGE : STATE UNKNOW CENTER LINE IS HIGH INPEDANCE "OFF" STATE
Rise Time: 1V/ns
Fall Time: 1V/ns
1. Including jig and scope capacitance.
n AC ELECTRICAL CHARACTERISTICS (TA = -40 C to +85 C) READ CYCLE
JEDEC PARAMETER NAME PARANETER NAME CYCLE TIME : 55ns DESCRIPTION Read Cycle Time Address Access Time Chip Select Access Time Output Enable to Output Valid Chip Select to Output Low Z Output Enable to Output Low Z Chip Select to Output High Z Output Enable to Output High Z Data Hold from Address Change MIN. 55 ---10 10 --10 TYP. ---------MAX. -55 55 30 --30 25 -UNITS ns ns ns ns ns ns ns ns ns
O
O
tAVAX tAVQX tE1LQV tGLQV tE1LQX tGLQX tE1HQZ tGHQZ tAVQX
tRC tAA tACS tOE tCLZ tOLZ tCHZ tOHZ tOH
n SWITCHING WAVEFORMS (READ CYCLE) READ CYCLE 1
(1,2,4)
tRC ADDRESS tOH DOUT tAA tOH
R0201-BH62UV4000
4
Revision 1.2 Aug. 2006
BH62UV4000
READ CYCLE 2
(1,3,4)
CE tACS tCLZ DOUT
(5)
tCHZ
(5)
READ CYCLE 3
(1, 4)
tRC ADDRESS tAA OE tOE CE
(5)
tOH
tOLZ tACS tCLZ tOHZ tCHZ
(5) (1,5)
DOUT
NOTES: 1. WE is high in read Cycle. 2. Device is continuously selected when CE = VIL 3. Address valid prior to or coincident with CE transition low and/or CE2 transition high. 4. OE = VIL. 5. Transition is measured 500mV from steady state with CL = 5pF. The parameter is guaranteed but not 100% tested.
R0201-BH62UV4000
5
Revision 1.2 Aug. 2006
BH62UV4000
n AC ELECTRICAL CHARACTERISTICS (TA = -40 C to +85 C) WRITE CYCLE
JEDEC PARAMETER NAME PARANETER NAME DESCRIPTION Write Cycle Time Address Set up Time Address Valid to End of Write Chip Select to End of Write Write Pulse Width Write Recovery Time Write to Output High Z Data to Write Time Overlap Data Hold from Write Time Output Disable to Output in High Z End of Write to Output Active (CE, WE) 55 0 45 45 35 0 -25 0 -5 CYCLE TIME : 55ns MIN. TYP. -----------MAX. ------20 --25 -ns ns ns ns ns ns ns ns ns ns ns UNITS
O O
tAVAX tAVWL tAVWH tELWH tWLWH tWHAX tWLQZ tDVWH tWHDX tGHQZ tWHQX
tWC tAS tAW tCW tWP tWR tWHZ tDW tDH tOHZ tOW
n SWITCHING WAVEFORMS (WRITE CYCLE) WRITE CYCLE 1
(1)
tWC ADDRESS tWR OE tCW CE
(5) (11) (3)
tAW WE tAS tOHZ DOUT tDH tDW DIN
(4,10)
tWP
(2)
R0201-BH62UV4000
6
Revision 1.2 Aug. 2006
BH62UV4000
WRITE CYCLE 2
(1,6)
tWC ADDRESS tCW
(11)
CE
(5)
tAW WE tAS tWHZ DOUT
(4,10)
tWP
(2)
tOW tDW tDH
(8,9)
(7)
(8)
DIN
NOTES: 1. WE must be high during address transitions. 2. The internal write time of the memory is defined by the overlap of CE and WE low. All signals must be active to initiate a write and any one signal can terminate a write by going inactive. The data input setup and hold timing should be referenced to the second transition edge of the signal that terminates the write. 3. tWR is measured from the earlier of CE or WE going high at the end of write cycle. 4. During this period, DQ pins are in the output state so that the input signals of opposite phase to the outputs must not be applied. 5. If the CE low transition occurs simultaneously with the WE low transitions or after the WE transition, output remain in a high impedance state. 6. OE is continuously low (OE = VIL). 7. DOUT is the same phase of write data of this write cycle. 8. DOUT is the read data of next address. 9. If CE is low during this period, DQ pins are in the output state. Then the data input signals of opposite phase to the outputs must not be applied to them. 10. Transition is measured 500mV from steady state with CL = 5pF. The parameter is guaranteed but not 100% tested. 11. tCW is measured from the later of CE going low to the end of write.
R0201-BH62UV4000
7
Revision 1.2 Aug. 2006
BH62UV4000
n ORDERING INFORMATION
BH62UV4000
X
X
Z
YY
SPEED 55: 55ns
PKG MATERIAL -: Normal G: Green, RoHS Compliant
GRADE I: -40oC ~ +85oC PACKAGE D: DICE E: TSOP-II H: BGA-36-0608 P: PDIP S: SOP ST: Small TSOP (8mm x 13.4mm) T: TSOP (8mm x 20mm)
Note: Brilliance Semiconductor Inc. (BSI) assumes no responsibility for the application or use of any product or circuit described herein. BSI does not authorize its products for use as critical components in any application in which the failure of the BSI product may be expected to result in significant injury or death, including life-support systems and critical medical instruments.
n PACKAGE DIMENSIONS
WITH PLATING
b
c
c1
BASE METAL
b1
SECTION
A-A
SOP -32
R0201-BH62UV4000
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Revision 1.2 Aug. 2006
BH62UV4000
n PACKAGE DIMENSIONS (continued)
STSOP - 32
TSOP - 32
R0201-BH62UV4000
9
Revision 1.2 Aug. 2006
BH62UV4000
n PACKAGE DIMENSIONS (continued)
PDIP - 32
NOTES : 1: CONTROLLING DIMENSIONS ARE IN MILLIMETERS. 2: PIN#1 DOT MARKING BY LASER OR PAD PRINT. 3: SYMBOL "N" IS THE NUMBER OF SOLDER BALLS.
1.2 Max.
BALL PITCH e = 0.75 D 8.0 E 6.0 N 48 D1 5.25 E1 3.75
D1
e
VIEW A
36 mini-BGA (6 x 8mm)
R0201-BH62UV4000
E1
10
Revision 1.2 Aug. 2006
BH62UV4000
n PACKAGE DIMENSIONS (continued)
DIMENSION (MM) MIN. A
TX
32
17
DIMENSION (INCH) MAX.
1.20
NOM.
MIN.
NOM.
MAX.
0.047
E1 -XE
A1 A2
0.05 0.95 0.30 0.30 0.12 0.10 20.82 11.56 10.03
0.10 1.00 0.40 0.127 20.95 11.76 10.16 1.27 BASIC
0.15 1.05 0.52 0.45 0.21 0.16 21.08 11.96 10.29
0.002 0.037 0.012 0.012 0.005 0.004 0.820 0.455 0.394
0.004 0.039 0.016 0.005 0.825 0.463 0.400 0.050 BASIC
0.006 0.042 0.020 0.018 0.008 0.006 0.830 0.471 0.405
0.20
b b1 c c1 D
1 YY
e
b
16
E
"X"
E1 e L L1
0.40
0.50 0.25 BASIC 0.8 REF
0.60
0.016
0.020 0.010 BASIC 0.031 REF
0.024
D ZD A2 A
L2 R R1 ZD 0.12 0.12
0.25
0.005 0.005 0.037 REF
0.010
0.95 REF 0.10
A1
Y -T-
SEATING PLANE
Y
0.004
0.44 REF
RAD R L1 GAGE PLANE
b b1
L 0 ~8 L2
RAD R1
WITH PLATING
BASE METAL
NOTE: 1. CONTROLLING DIMENSION : MILLIMETERS. 2. REFREENCE DOCUMENT : JEDEC MS-024 3. DIMENSION D DOES NOT INCLUDE MOLD PROTRUSION. MOLD PROTRUSION SHALL NOT EXCEED 0.15(0.006") PER SIDE. DIMENSION E1 DOES NOT INCLUDE INTERLEAD PROTRUSION. INTERLEAD PROTRUSION SHALL NOT EXCEED 0.25(0.01") PER SIDE. 4. DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSIONS/INTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL NOT CAUSE THE LEAD TO BE WIDER THAN THE MAX b DIMENSION BY MORE THAN 0.13mm DAMBAR INTRUSION SHALL NOT CAUSE THE LEAD TO BE NARROWER THAN THE MIN b DIMENSION BY MORE THAN 0.07mm.
c
DETAIL "X"
0.44 REF
SECTION Y-Y
TSOP II - 32
c1 c
R0201-BH62UV4000
11
Revision 1.2 Aug. 2006
BH62UV4000
n Revision History Revision No. 1.0 1.1 History Initial Production Version Change I-grade operation temperature range - from -25OC to -40OC To Add 600 mil PDIP package type To Add 400 mil TSOP-II package type To Add 36-ball BGA package type To Improve Icc spec. - from 12mA to 10mA Draft Date Dec. 21,2005 May. 25, 2006 Remark Initial
1.2
Aug. 08, 2006
R0201-BH62UV4000
12
Revision 1.2 Aug. 2006

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